The new 200 mm SiC epi-wafers are engineered with cutting-edge thickness and doping uniformity, setting new industry standards and supporting the production of superior SiC power semiconductors.

Infineon maintains that the chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter fits 2.3 ...

Move to larger wafers. The semiconductor industry is in the process of moving from 200 mm to 300 mm wafers – which doubles the number of chips that can be produced from a wafer. Processing the larger ...

SkyWater Technology SKYT is making a strategic move with its planned acquisition of Fab-25 from Infineon Technologies, ...

CCRAFT, the thin-film lithium niobate (TFLN) photonic chip foundry recently spun out of Switzerland’s Centre Suisse ...

We assume long-term 200 mm wafer volumes to fall as new chips are moving to 300 mm wafers. We also expect more pricing pressure as auto and industrial applications take longer to recover, ...

A 300-mm wafer refers to a silicon wafer with a diameter of 300 millimeters, used primarily in semiconductor manufacturing. These large wafers yield more chips per wafer than their smaller 200-mm ...

The new 200 mm SiC epi-wafers are engineered with cutting-edge thickness and doping uniformity, setting new industry standards and supporting the production of superior SiC power semiconductors.

PITTSBURGH, Sept. 26, 2024 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in materials, networking, and laser technologies, announced today the launch of its 200 mm silicon carbide ...

PITTSBURGH, Sept. 26, 2024 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in materials, networking, and laser technologies, announced today the launch of its 200 mm silicon carbide ...