In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

Under the Engineering Roadmap, Biocore and FRI—with funding support provided by the NFL—collaborated with partners at the University of Virginia, Wake Forest University School of Medicine, KTH Royal ...

A finite element model for progressive in-plane damage and interfacial delamination was presented for cross-ply composite laminates. The commercial finite element software ABAQUS/STANDARD was used for ...

This is a preview. Log in through your library . Abstract Very few finite element head models have been validated as required before being used to study brain injury mechanisms. This paper deals with ...

What Are FEM, FDM and FVM? FEM, FDM and FVM differ from one another in important ways. Understanding these distinctions is key to selecting the method most appropriate for your purposes. The ...

AxisVM is a high-quality software package for civil engineers. It is a useful tool for engineers in numerous countries. Users can build the 3D model with the aid of integrated visual modeling and ...