Abstract: In the semiconductor industry, the memory device has not been considered as a high power consuming product. However, the increase in the market requirements for high speed and high density ...

Rabat – Companies like Samsung Electronics and SK Hynix have had to shift their production capacity to high-bandwidth memory (HBM) chips intended for AI workloads that will respond to the explosion in ...

SEOUL, Oct 21 (Reuters) - The global rush by chipmakers to produce AI chips is tightening supply of less glamorous chips used in smartphones, computers and servers, spurring panic buying by some ...

The memory industry faces a severe capacity crunch as global manufacturers rush upstream to secure DRAM production for 2026, sparking fears of supply chain disruptions. Despite limited new capacity ...

Intel has shared new details about its next big data center GPU, code-named Crescent Island, and it’s bringing something new to the table: the Xe3P architecture. Announced at the OCP Global Summit, ...

Abstract: DRAM scalability is becoming a limiting factor to the available memory capacity in consumer devices. As a potential solution, manufacturers have introduced emerging non-volatile memories ...