A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.

Two DC stages DC-to-DC conversion typically starts with 48 V (or sometimes 54 V), and first drops it to 12 or 6 V. Then it is ...

Tackling a composite challenge that combines multi-stage task planning, long-context work, environment interaction, and ...

Emerging chiplet, memory, and interconnect technologies demand layered, automated solutions to deliver predictable ...

Compute Express Link (CXL) was created to address these problems through CXL.mem, which offers memory expansion, memory ...

As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...

While everybody seems to agree that AI will disrupt semiconductor design and EDA tools, nobody has yet suggested what a ...

AI is a set of algorithms capable of solving problems. But how relevant are they to the tasks that EDA performs?

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.

Coherent vs. non-coherent interfaces, heterogeneous vs. homogeneous, and other considerations with chiplets.