Imec and TNO have officially launched the Holst Centre Photonics Lab, a state-of-the-art facility dedicated to integrated ...

GaN (Gallium Nitride) technology innovator Finwave Semiconductor has announced a successful $8.2m bridge investment round.

Rambus has made available complete client chipsets for next-generation AI PC memory modules with two new PMICs.

Hirose has developed an automotive wire-to-board connector that meets the GMW3191 standard for automotive applications.

OMRON Electronic Components Europe has introduced the G9EJH-1-E, an ultra-compact DC power relay, delivering inrush ...

Despite several profitable quarters Microsoft has announced that it plans to lay off nearly 3% of its entire workforce.

Critically, fostering collaboration between analogue and digital teams creates the cultural change necessary for success. The ...

Questa One smart verification software portfolio combines connectivity, a data driven approach and scalability with AI.

Following on from the Sycamore µSpeaker, launched in late 2024, the Sycamore-W extends xMEMS’ commitment to µFidelity audio ...

Samsung, much like Intel, has been looking to close the gap with TSMC by landing major external orders for its 2nm node.

ST inertial measurement unit combines sensors for activity tracking and high-g impact measurement in a single package.

CELUS, the AI-assisted electronics design platform developer, has announced its next generation of AI driven hardware.