Scientists are developing a smart textile band that can detect and monitor sarcopenia, improving healthy ageing.

AIchip, a developer of ASICs, together with Ayar Labs, a specialist in co-packaged optics (CPO) for large-scale AI workloads, ...

Infineon and ROHM sign an agreement to collaborate on packages for silicon carbide (SiC) power semiconductors.

Toshiba Electronics Europe has launched the TPH2R70AR5, a new 100V-rated N-channel power MOSFET. The device has been ...

The SMP Bullet provides high-density solutions, supporting both board-to-board and cable-to-board connections. Available for ...

First hybrid memory technology to support adaptive local training and inference of artificial neural networks unveiled.

Reports are suggesting that Intel has approached TSMC to discuss potential investments or manufacturing partnerships ...

Imec, the Belgian R&D centre for advanced semiconductor technologies, has used the 2025 SPIE Photomask Technology + EUV ...

ARM has now announced a new Indian office that will be reportedly used to accelerate advanced 2nm chip designs.

GF is collaborating with Egis Technology to deliver direct time-of-flight (dToF) sensors on the company's 55nm platform.

Embedd.it, a creator of embedded development tools, has announced the launch of the Graphical MCU Configurator.

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern ...