Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

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At the same time, the rectifiers' optimised copper mass design and advanced die placement technology allow for superior thermal performance that enables operation at higher current ratings. The ...

8mm x 8mm x 1mm) surface mount package includes a large underside heat pad, which lowers thermal resistance. It needs less board space and a larger heat pad, so it is an ideal alternative to the TO252 ...