In key processes such as wafer transfer, gas control, and cavity protection, alumina ceramic components have become an ...

ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics ...

The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a CAGR of 5.56% during the ...

According to HCL Group Chairperson Roshni Nadar Malhotra, the project will combine “HCL’s engineering DNA” with “Foxconn’s ...

The government of India has approved a ₹3,706 crore semiconductor production unit in Jewar, Uttar Pradesh. This is a large ...

Union Cabinet gave its approval for a new joint venture between HCL and Foxconn to set up a semiconductor wafer fabrication ...

The plant will manufacture display driver chips for mobile phones, laptops, automobiles, and other devices, said IT Minister ...

The plant will be established near the Jewar International Airport, located in the Yamuna Expressway Industrial Development ...

Union Cabinet approves HCL-Foxconn semiconductor plant in Jewar, Uttar Pradesh, boosting India's semiconductor industry ...

The proposed HCL-Foxconn semiconductor plant will manufacture display driver chips for mobile phones, laptops, automobiles, ...

The Union Cabinet, chaired by Prime Minister Narendra Modi, has cleared the establishment of a new semiconductor unit in UP's ...

A simple and scalable annealing method boosts the quality of materials used in cell phones, sensors and energy harvesting ...