Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.

Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. Abstract “Memory-centric computing aims to ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

Next-gen EUV laser R&D; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron's $2B Virginia fab expansion; Tesla sales slump; USB-C mandate in Europe.

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...