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Ceramic boost for 28GHz mmWave 5G modules

Ceramic boost for 28GHz mmWave 5G modules

eenewseurope.com

First eSIM to meet SGP.32 standard for mass IoT networks

First eSIM to meet SGP.32 standard for mass IoT networks

eenewseurope.com

300mm wafer for GaN devices

300mm wafer for GaN devices

eenewseurope.com

Glass substrate alliance for AI chiplets

Glass substrate alliance for AI chiplets

eenewseurope.com

Volvo Cars pulls back on electrification

Volvo Cars pulls back on electrification

eenewseurope.com

Carpentopod: A walking table project

Carpentopod: A walking table project

eenewseurope.com

Next generation ion-driven cooling

Next generation ion-driven cooling

eenewseurope.com

Innodisk develops CXL memory module

eenewseurope.com

Chiplet market to top $411bn by 2035

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BelGan sees bids for Belgian power fab

eenewseurope.com

Kioxia files for Tokyo IPO in October

eenewseurope.com

CUI Devices rebrands as Same Sky

eenewseurope.com

First spin qubit quantum computers for Europe

eenewseurope.com

TJ Rodgers at heart of US solar panel consolidation

eenewseurope.com

Intel seeks foundry alliance with Samsung, says report

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Room temperature THz sensor for 6G wireless

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Superior GaN-like material made using MOCVD

eenewseurope.com

Digital Film Cartridge for Analog 35 mm cameras

eenewseurope.com

Perovskite tandem solar cell with 30.9% efficiency

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Ilika solid state battery passes nail penetration test

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SiFive launches Premier P550 RISC-V development board

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AI demand set to drive processor market boom

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Intel announces Kelleher's successor in technology develop…

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Fourth generation 700V GaN transistors target consumer, indu…

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Habana Labs' founders leave Intel to form AI startup

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ASE shows vertical power for AI data centres

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Infineon, Amkor to build chip packaging plant in Porto

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Rapidus taps Seiko Epson for chiplet cleanroom

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5nm Telum II processor for IBM AI

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Miniature zinc air batteries for tiny robots

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